To fill the throughput gap and reduce costs, electronics manufacturers traditionally look for machines with higher speed, impressive specifications, and a low price. But our experience shows that this is not the way to address our customers' true needs.

The challenges electronics manufacturers are facing today require a different approach. Let us talk to you about how to:

• optimize production
• maximize operational efficiency
• reduce total machine idle time
• reduce inventory levels and work in progress
• increase total production output
• reduce lead time

The good news is that the future is already here. In fact, it's just in time. Is your factory ready?

Let's meet and discuss!

With its new 2017 roadshow, SMT expert Mycronic is bringing a live demonstration of the benefits of the new MYPro series SMT line right to your door.

The roadshow uses a vehicle equipped with a complete and fully operational SMT production line so that visitors can see the latest Mycronic technology in action and discover how to optimize their production processes to maximize throughput.

The new MYPro series makes it possible to do more than ever before in a 40% smaller footprint than previous generations. Mount any component on any board. Handle any batch or series with zero changeover times. Jet high-precision solder paste and adhesives at record speeds. Simply put, it's the smartest way to boost quality and utilization across a vast range of challenging applications.

Fully integrated with the SMD Tower automated material handling system, MYCenter software suite and award-winning Agilis feeder systems, the new MYPro series is designed for full compatibility with the Mycronic 4.0 intelligent factory.

The new MY700 Jet Printer and Dispenser combines solder paste jet printing with jet dispensing of adhesives, UV materials, epoxies and more – with micrometer precision and at speeds of more than one million dots per hour. The unique dual-head, dual-lane design means this can all be done with the same compact machine in the same process step, so there's virtually no board, package or component the MY700 can't handle.

The new MY300 pick-and-place machine expands capacity up to 224 feeder positions in a 40% smaller footprint than previous models. At the same time, it also achieves higher real speeds with performance enhancements that include automatic job selection and rolling changeover, as well as faster board transfer and tool changes. Fully automated board train functionality is now standard on MY300DX and SX models, which significantly increases throughput thanks to simultaneous assembly of multiple boards. Additionally, the series' improved linescan vision system, with up to 4k resolution, ensures a future-proof solution for even the most advanced fine-pitch components.